Xiaomi XRING O3 Shatters 5.2 Million AnTuTu Record in Upcoming Xiaomi 18 Fold
Xiaomi's in-house 3nm XRING O3 processor breaks benchmark records, surpassing 5.22 million points on AnTuTu v11 ahead of the Xiaomi 18 Fold launch.
In official synthetic performance validations published ahead of its mid-September commercial launch, Xiaomi's proprietary 3nm mobile processor—the XRING O3—shattered the benchmark ceiling by scoring an unprecedented 5,224,180 points in AnTuTu v11. Powering the upcoming Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max, the XRING O3 combines TSMC's 3nm N3P process, ultra-fast 10.67 Gbps LPDDR6 memory, and an 80 TOPS Neural Processing Unit to eclipse competing flagship silicon in raw computing density and on-device AI throughput.
Silicon Architecture: Breaking the 5-Million AnTuTu Threshold
Fabricated with 24 billion transistors across a 133mm² monolithic die, the XRING O3 employs a custom 10-core CPU topology featuring dual Cortex-X925 prime cores clocked at 4.40GHz, six performance cores at 3.40GHz, and two high-efficiency cores. Paired with next-generation LPDDR6 memory delivering 113.8 GB/s peak bandwidth, memory latency is reduced by 32%, allowing the 16-core Immortalis GPU and on-die NPU to sustain maximum theoretical clock speeds without thermal throttling.
Key Benchmark & Hardware Metrics
- AnTuTu v11 Benchmark Score: Reaches a record 5,224,180 total points (CPU: 1.18M, GPU: 2.14M, MEM: 1.05M, UX: 854K).
- Process Node: Fabricated on TSMC 3nm (N3P) with second-generation backside power rails.
- Memory Subsystem: Industry-first commercial LPDDR6 integration operating at 10,667 Mbps.
- Neural Engine Throughput: 80 TOPS dedicated NPU running on-device 14B parameter multimodal AI models locally at 42 tokens/sec.
- Thermal Architecture: Paired with Xiaomi's 3D dual-channel IceLoop vapor chamber in the sub-9.2mm chassis of the Xiaomi 18 Fold.
A Defining Shift Toward Silicon Independence
The XRING O3's record-setting benchmark cements Xiaomi's transition into top-tier proprietary semiconductor design. By developing custom silicon tailored specifically to the multi-window multitasking and on-device generative AI needs of foldable form factors, Xiaomi establishes full architectural autonomy alongside Apple and Huawei.
Chipset Specification Sheet
| Feature | Details |
|---|---|
| Processor Name | Xiaomi XRING O3 |
| Fabrication Process | TSMC 3nm (N3P) |
| Transistor Count | 24 Billion |
| Memory Support | LPDDR6 (10,667 Mbps / 113.8 GB/s) |
| Debut Devices | Xiaomi 18 Fold, Xiaomi Pad 9 Pro Max |
| Primary Benchmark | 5,224,180 Points (AnTuTu v11) |